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项目Item
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制作能力Manufacure Capability
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层数
Layers
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2-16L
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板材类型
Material Types
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FR-4, 高TG，无卤素 (FR-4, High TG，Halogen Free) |
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最大尺寸
Max.Panel Dimension
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546mm*622mm
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外形尺寸公差
Outline Tolerance
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±0.10mm
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板厚范围
Board Thickness
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0.40mm-3.20mm
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板厚公差
Board thickness Tolerance(t=0.8mm)
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±8%
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最小线宽
Min.track Width
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0.075mm
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最小线距
Min.track Width
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0.075mm
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外层铜厚
External Cu.Thickness
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35um-140um
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内层铜厚
Internal Cu.Thickness
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17um-140um
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钻孔孔径(机械钻)
Drilling Bit Size(CNC)
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0.20mm-6.0mm
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成孔孔径(机械钻)
Finished Hole Dimension(CNC)
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0.10mm-5.95mm
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孔径公差(机械钻)
Hole Tolerance(CNC)
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±0.075mm/±0.05mm
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孔位公差(机械钻)
Hole Postion Tolerance(CNC) |
±0.05mm |
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钻孔孔径(激光钻)
Laser Drilling Hole Size
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0.1mm-6.0mm
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板厚孔径比
Board Thickness Min.Hole Dimension
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8:1
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阻焊类型
Solder Mask
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感光油墨(绿/红/黄/黑/紫/白/兰/哑绿/哑黑等颜色)
LPI Solder Resistink(Green,Red,Yellow,Black,Purple,White,Matt Green,Matt Black etc.)
|
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最小阻焊桥宽
Min Solder Mask Bridge
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0.0635mm
|
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阻抗公差
Impedance Control Tolerance
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±10% |
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胀缩公差
Expansion & Shrinkage Tolerance
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+0.0254mm |
表面处理类型
Surface Finishing |
无铅喷锡 化学镍金 化学锡 化学银 抗氧化
(HAL LF, ENIG, Immersion Tin, Immersion Silver, OSP) |
